- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
6,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 2.5W... |
1 |
3,797
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 TA... |
1 |
2,082
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 TA... |
1 |
3,868
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-202 LO... |
1 |
1,754
In-stock
|
Get Quote |
