- Manufacturer:
-
- Aavid (8)
- CTS Corporation (1)
- Ohmite (1)
- Material:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
20 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
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CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | ||
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Aavid | BOARD LEVEL HEAT... |
16,000 |
3,000
In-stock
|
Get Quote | ||
![]() |
ASSMANN WSW Components | HEATSINK ALUM AN... |
600 |
3,000
In-stock
|
Get Quote | ||
![]() |
Aavid | BOARD LEVEL HEAT... |
6,000 |
3,000
In-stock
|
Get Quote | ||
![]() |
Aavid | BOARD LEVEL HEAT... |
3,500 |
3,000
In-stock
|
Get Quote | ||
![]() |
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEAT SINK PIN FIN... |
180 |
3,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEAT SINK ELLIP F... |
180 |
3,000
In-stock
|
Get Quote | ||
![]() |
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | ||
![]() |
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | HEAT SINK BGA 37.5M... |
1 |
3,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEAT SINK ELLIP F... |
180 |
3,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 35MM LOW P HS ASSY... |
350 |
3,000
In-stock
|
Get Quote | ||
![]() |
Aavid | HEATSINK TO-220 W/P... |
1 |
3,340
In-stock
|
Get Quote | ||
![]() |
Ohmite | HEATSINK W/CLIP F... |
1 |
3,000
In-stock
|
Get Quote | ||
![]() |
Aavid | HEATSINK TO-220 TA... |
1 |
3,584
In-stock
|
Get Quote | ||
![]() |
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
3,535
In-stock
|
Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
7,605
In-stock
|
Get Quote | ||
![]() |
ASSMANN WSW Components | HEATSINK ANOD AL... |
1 |
767
In-stock
|
Get Quote | ||
![]() |
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
61
In-stock
|
Get Quote |