- Manufacturer：
-
- Aavid (4)
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,500 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
500 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEAT SINK |
500 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
5
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
3,000
In-stock
|
Get Quote |
