- Manufacturer：
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- CUI Devices (2)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,350 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
128 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
180 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
180 |
3,000
In-stock
|
Get Quote |
