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Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB06-181810 CUI Devices
HEAT SINK, BGA, 18 ...
1
RFQ
1,582
In-stock
Get Quote
ATS-1178-C1-R0 Advanced Thermal Solutions, Inc.
1/8 BRICK HEATSINK...
1
RFQ
70
In-stock
Get Quote
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