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Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
ATS-PCB1070 Advanced Thermal Solutions, Inc.
HEATSINK TO-220 BL...
1
RFQ
561
In-stock
Get Quote
HSB03-141406 CUI Devices
HEAT SINK, BGA, 14 ...
1
RFQ
2,354
In-stock
Get Quote
ATS-PCB1069 Advanced Thermal Solutions, Inc.
HEATSINK TO-220 BL...
1
RFQ
432
In-stock
Get Quote
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