- Manufacturer：
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- Aavid (1)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | HEATSINK BGA W/AD... |
1 |
784
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
1,798
In-stock
|
Get Quote |
