- Manufacturer：
-
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Apex Microtechnology | HEATSINK 8P TO-3 15... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK C2026 REV... |
1 |
60
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 5.5X5X2.5" ... |
1 |
46
In-stock
|
Get Quote |
