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Material:
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Material Finish:
Image Part Manufacturer Description MOQ Stock Action
HS24 Apex Microtechnology
HEATSINK SMT
1
RFQ
3,000
In-stock
Get Quote
291-H36AB Wakefield Thermal
HEATSINK TO-220 BO...
1
RFQ
3,000
In-stock
Get Quote
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