- Manufacturer：
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- CUI Devices (1)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 21X12MM D... |
1 |
20
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1 |
225
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1 |
43
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
114
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM S... |
1 |
116
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,949
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1 |
27
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1 |
41
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM F... |
1 |
77
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X7.5M... |
10 |
3,000
In-stock
|
Get Quote |
