- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (2)
- Material：
-
- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 60 ... |
500 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
100 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
180 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1 |
132
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
211
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,212
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X24.5M... |
10 |
3,000
In-stock
|
Get Quote |
