- Manufacturer：
-
- Comair Rotron (1)
- Ohmite (2)
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Material Finish：
-
8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK FOR TO-1... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-1... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 35MM... |
1 |
1,219
In-stock
|
Get Quote |
