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Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS12-B20-P95 CUI Devices
HEAT SINK, STAMPI...
6,750
RFQ
3,000
In-stock
Get Quote
ATS-51170K-C1-R0 Advanced Thermal Solutions, Inc.
HEAT SINK 17MM X 17...
1
RFQ
155
In-stock
Get Quote
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