- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Material Finish：
-
10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK BXB50,75,1... |
320 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DC/DC HA... |
320 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DC/DC HA... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DC/DC HA... |
320 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DC/DC HA... |
320 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DC/DC HA... |
1 |
2,493
In-stock
|
Get Quote | ||
|
|
Aavid | 65245 EXTRUSION 1.65X... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
3,000
In-stock
|
Get Quote |
