- Manufacturer：
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- CUI Devices (1)
- Part Status：
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- Material：
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- Package Cooled：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | BOARD LEVEL HEAT... |
3,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
3,672 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
1 |
18,763
In-stock
|
Get Quote |
