- Manufacturer：
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- Comair Rotron (1)
- Part Status：
-
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Material Finish：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK FOR 25MM... |
1,100 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 25MM... |
1,600 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 25MM... |
1,600 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 25MM... |
1,600 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 13... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
1 |
3,765
In-stock
|
Get Quote |
