- Manufacturer：
-
- CUI Devices (1)
- Part Status：
-
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK FOR TO21... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VE... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO21... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
150 |
600
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VR... |
1 |
8,102
In-stock
|
Get Quote |
