- Manufacturer：
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- CUI Devices (2)
- Part Status：
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- Material：
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- Type：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 6.5W... |
6,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 27MM HS ASSY ULTEM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 37.5MM HS ASSY ULTE... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 35MM HS ASSY ULTEM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 29MM HS ASSY ULTEM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 27MM HS ASSY ULTEM... |
1 |
3,000
In-stock
|
Get Quote |
