- Manufacturer：
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- CTS Corporation (2)
- Type：
-
- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-220 |
5,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK CPU W/AD... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK CPU W/AD... |
2,000 |
3,000
In-stock
|
Get Quote |
