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Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE-B20500-040H-01 CUI Devices
HEAT SINK, EXTRUS...
1,800
RFQ
3,000
In-stock
Get Quote
ATS-PCBT1078 Advanced Thermal Solutions, Inc.
HEATSINK TO-220 BL...
1
RFQ
2,139
In-stock
Get Quote
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