- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (1)
- WEC (1)
- Part Status：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
18 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
700 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
700 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO21... |
1,080 |
3,000
In-stock
|
Get Quote | ||
|
|
WEC | 40MM HS ASSY ULTEM... |
1 |
195
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEAT SINK FORGED... |
300 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VE... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | HTS521-U=45MM LOW HS... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VE... |
700 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO21... |
700 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
1 |
740
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
543
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1 |
370
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
95
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X24.5M... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
1 |
70
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 42.5 X 42.5... |
1 |
67
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 42.5X42.5X1... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X19.5M... |
10 |
3,000
In-stock
|
Get Quote |
