- Manufacturer：
-
- CTS Corporation (2)
- CUI Devices (1)
- Part Status：
-
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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11 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 23X33MM D... |
100 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 40X40X12MM... |
1 |
850
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
54
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
1 |
932
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X33MM S... |
1 |
88
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X33MM F... |
1 |
54
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 29X23MM S... |
1 |
98
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 29X23MM D... |
1 |
66
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 29X23MM F... |
1 |
44
In-stock
|
Get Quote |
