- Part Status：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
-
10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,400 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,400 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
2,400 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 27.9M... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
7,106
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
1,048
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 27.9M... |
1 |
1,679
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
4,737
In-stock
|
Get Quote |
