- Manufacturer：
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- CTS Corporation (3)
- CUI Devices (1)
- Part Status：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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26 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 31X23MM F... |
1 |
96
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 31X23MM D... |
1 |
59
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X2... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X17.5M... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 32.5X32.5X1... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
100 |
3,000
In-stock
|
Get Quote |
