- Manufacturer：
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- CUI Devices (1)
- Part Status：
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- Material：
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- Type：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1,280 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
1 |
905
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
1 |
68
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM F... |
1 |
99
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM S... |
1 |
92
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM D... |
1 |
87
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X1... |
10 |
3,000
In-stock
|
Get Quote |
