- Manufacturer:
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- CUI Devices (1)
- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, BGA, 40 ... |
1,280 |
3,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1 |
172
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
10
In-stock
|
Get Quote |