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Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB11-252518 CUI Devices
HEAT SINK, BGA, 25 ...
1
RFQ
687
In-stock
Get Quote
HSB19-272718 CUI Devices
HEAT SINK, BGA, 27 ...
1
RFQ
466
In-stock
Get Quote
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