- Manufacturer:
-
- CUI Devices (1)
- Material:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
5 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
3,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
796
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 35X35X23MM... |
1 |
39
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 35X35X23MM... |
1 |
43
In-stock
|
Get Quote |