- Manufacturer:
-
- Aavid (1)
- CUI Devices (1)
- Ohmite (2)
- WEC (1)
- Part Status:
-
- Material:
-
- Shape:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
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- Material Finish:
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20 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
100 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CPU 28MM... |
1,200 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CPU 28MM... |
1,200 |
3,000
In-stock
|
Get Quote | |||
Aavid | HEAT SINK |
1,500 |
3,000
In-stock
|
Get Quote | |||
WEC | HEAT SINK BGA 21MM... |
250 |
1,894
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CPU 28MM... |
1,000 |
3,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1 |
421
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
353
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
4,886
In-stock
|
Get Quote | |||
Ohmite | HEATSINK DUAL FO... |
1 |
203
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
1 |
87
In-stock
|
Get Quote | |||
Ohmite | HEATSINK DUAL FO... |
1 |
58
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | HEAT SINK BGA 21MM... |
1 |
11
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 21X21X24.5M... |
10 |
3,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X24.5M... |
10 |
3,000
In-stock
|
Get Quote |