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Package Cooled:
Attachment Method:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS-B20-NP-12 CUI Devices
HEATSINK TO-220 6.8W...
1
RFQ
3,234
In-stock
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HSB19-272718 CUI Devices
HEAT SINK, BGA, 27 ...
1
RFQ
466
In-stock
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