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Package Cooled:
Attachment Method:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE-B20635-035H-01 CUI Devices
HEAT SINK, EXTRUS...
1,200
RFQ
3,000
In-stock
Get Quote
HSB16-404018 CUI Devices
HEAT SINK, BGA, 40 ...
1
RFQ
1,212
In-stock
Get Quote
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