- Manufacturer：
-
- CUI Devices (3)
- WEC (1)
- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.9W... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
WEC | HEATSINK TO-220 2.9W... |
46 |
1,446
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
1,814
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
293
In-stock
|
Get Quote |
