- Manufacturer：
-
- CUI Devices (1)
- Part Status：
-
- Type：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 60 ... |
500 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK CLIP-ON... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR BGA... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
1,320
In-stock
|
Get Quote | ||
|
|
TE Connectivity Raychem Cable Protection | HEAT SINK |
1 |
256
In-stock
|
Get Quote |
