- Manufacturer：
-
- CUI Devices (10)
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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15 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.1W... |
8,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
4,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
5,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
352
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
53
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
72
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,970
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,424
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR TO22... |
1 |
317
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
1 |
678
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
293
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
382
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
1 |
200
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
90
In-stock
|
Get Quote |
