- Manufacturer:
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- CUI Devices (1)
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEATSINK TO-220 4.4W... |
3,000 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
52
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
3,000
In-stock
|
Get Quote |