- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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9 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEATSINK TO-220 9.8W... |
5,400 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,949
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,919
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,336
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
5,013
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,297
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,745
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,991
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,405
In-stock
|
Get Quote |