- Manufacturer:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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4 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK FOR TO3 |
250 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK FOR TO3 |
250 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK FOR TO3 |
250 |
3,000
In-stock
|
Get Quote | |||
NTE Electronics, Inc. | HEAT SINK-TO-3 TRA... |
1 |
1,088
In-stock
|
Get Quote |