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Part Status:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
ATS-PCB1039 Advanced Thermal Solutions, Inc.
HEATSINK TO-220
1
RFQ
3,000
In-stock
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HSS03-B20-P318 CUI Devices
HEAT SINK, STAMPI...
1
RFQ
2,297
In-stock
Get Quote
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