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Manufacturer:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
960-19-15-S-AB-0 Wakefield Thermal
HEATSINK 19X15MM S...
1
RFQ
94
In-stock
Get Quote
960-19-15-F-AB-0 Wakefield Thermal
HEATSINK 19X15MM F...
1
RFQ
3,000
In-stock
Get Quote
960-19-15-D-AB-0 Wakefield Thermal
HEATSINK 19X15MM D...
1
RFQ
3,000
In-stock
Get Quote
HSB18-232310 CUI Devices
HEAT SINK, BGA, 23 ...
1
RFQ
1,588
In-stock
Get Quote
960-23-12-F-AB-0 Wakefield Thermal
HEATSINK 23X12MM F...
1
RFQ
58
In-stock
Get Quote
960-23-12-S-AB-0 Wakefield Thermal
HEATSINK 23X12MM S...
1
RFQ
77
In-stock
Get Quote
960-23-12-D-AB-0 Wakefield Thermal
HEATSINK 23X12MM D...
1
RFQ
3,000
In-stock
Get Quote
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