- Manufacturer:
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- CUI Devices (1)
- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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10 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 40 ... |
1,280 |
3,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1 |
608
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1 |
147
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 23X21MM F... |
1 |
99
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 23X21MM S... |
1 |
92
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 23X21MM D... |
1 |
87
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X1... |
10 |
3,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X17.5M... |
10 |
3,000
In-stock
|
Get Quote |