- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Material Finish:
-
5 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
750 |
3,000
In-stock
|
Get Quote | |||
Aavid | HEAT SINK |
1 |
2,270
In-stock
|
Get Quote | |||
Ohmite | HEATSINK AND CLI... |
1 |
16,204
In-stock
|
Get Quote |