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Package Cooled:
Attachment Method:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Image Part Manufacturer Description MOQ Stock Action
HSS-C2540-SMT-TR CUI Devices
HEAT SINK TO-263 CO...
150
RFQ
600
In-stock
Get Quote
HSE-B2111-038 CUI Devices
HEAT SINK, EXTRUS...
1
RFQ
22,235
In-stock
Get Quote
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