- Manufacturer:
-
- CUI Devices (35)
- Wakefield Thermal (39)
- WEC (2)
- Part Status:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
84 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, EXTRUS... |
1,350 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | |||
WEC | HEAT SINK, EXTRUS... |
23 |
426
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
2,500 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
2,500 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,000
In-stock
|
Get Quote | |||
WEC | HEAT SINK, EXTRUS... |
19 |
274
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,500 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | FINGER-SHAPED-HE... |
500 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,500 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,440 |
3,000
In-stock
|
Get Quote |