- Manufacturer：
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- CUI Devices (2)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 3.6W... |
4,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
3,000 |
3,000
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
132
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
81
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
4,477
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ANOD AL... |
1 |
1,481
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
246
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
119
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR TO22... |
1 |
317
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
33
In-stock
|
Get Quote |
