- Manufacturer:
-
- Aavid (5)
- Comair Rotron (2)
- CUI Devices (2)
- DFRobot (2)
- Radian (8)
- Part Status:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
35 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | BOARD LEVEL HEAT... |
3,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM BL... |
5,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM NA... |
5,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM BL... |
5,000 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK TO-252 CO... |
10,500 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM NA... |
5,000 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
3,000
In-stock
|
Get Quote | |||
Apex Microtechnology | HEATSINK SMT |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK DPAK SM... |
1 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 22... |
1 |
3,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 26... |
1 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK TO-263 12.7... |
1 |
21,650
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEAT SINK COPPER... |
1 |
20,927
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEAT SINK COPPER... |
1 |
4,911
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
1 |
2,641
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
12,616
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
5,492
In-stock
|
Get Quote | |||
Aavid | TOP MOUNT HEATSI... |
1 |
11,061
In-stock
|
Get Quote | |||
Aavid | HEATSINK D-PAK3 T... |
1 |
7,298
In-stock
|
Get Quote |