- Manufacturer:
-
- Aavid (1)
- CTS Corporation (14)
- Ohmite (21)
- Seeed (3)
- Wakefield Thermal (28)
- Part Status:
-
- Type:
-
- Shape:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
87 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
528 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
606 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK ALUM AN... |
500 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
606 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
480 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | FINGER-SHAPED-HE... |
500 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
528 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
528 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
1,092 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK COMPACT |
250 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK COMPACT |
150 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK FOR TO3 |
250 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK FOR TO3 |
250 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK COMPACT |
140 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK COMPACT |
60 |
3,000
In-stock
|
Get Quote | |||
Seeed | ALUMINUM HEATSIN... |
1 |
43
In-stock
|
Get Quote | |||
Ohmite | VERTICAL MOUNT H... |
10 |
3,000
In-stock
|
Get Quote | |||
Ohmite | 116MM LG DEGREASED... |
3 |
3,000
In-stock
|
Get Quote | |||
Ohmite | 220W 16 OHMS VIT COR... |
16 |
16
In-stock
|
Get Quote | |||
Ohmite | 220 WATT .67 OHMS 10% |
2 |
2
In-stock
|
Get Quote |