- Manufacturer：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK FOR TO3 |
250 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO3 |
250 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO3 |
250 |
3,000
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK-TO-3 TRA... |
1 |
1,088
In-stock
|
Get Quote |
