- Manufacturer：
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- Ohmite (1)
- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
81
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
9
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
12
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK W/CLIP -... |
1 |
46
In-stock
|
Get Quote |
