- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,500 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-218/TO... |
1 |
9,053
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1 |
306
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-3 H31.7... |
1 |
600
In-stock
|
Get Quote |
