- Manufacturer:
-
- Aavid (37)
- Comair Rotron (8)
- CUI Devices (3)
- DFRobot (2)
- Radian (8)
- Seeed (2)
- T-Global Technology (23)
- Wakefield Thermal (21)
- Part Status:
-
- Type:
-
- Shape:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
127 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
T-Global Technology | PH3N NANO 101.6X38.1X... |
1 |
14
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK TO-220 PW... |
5,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK |
3,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | COPPER HEATSINK ... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | COPPER HEATSINK ... |
1 |
3,000
In-stock
|
Get Quote | |||
Aavid | HEAT SINK |
1,500 |
3,000
In-stock
|
Get Quote | |||
Aavid | COPPER HEATSINK ... |
100 |
3,000
In-stock
|
Get Quote | |||
Aavid | HEAT SINK |
1,000 |
3,000
In-stock
|
Get Quote | |||
Apex Microtechnology | HEATSINK SMT |
1 |
3,000
In-stock
|
Get Quote | |||
Seeed | RASPERRY PI COPP... |
1 |
5
In-stock
|
Get Quote | |||
Seeed | EXTREME COOLING ... |
20 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK DPAK SM... |
1 |
3,000
In-stock
|
Get Quote | |||
Aavid | COPPER HEATSINK ... |
1 |
3,000
In-stock
|
Get Quote | |||
Aavid | INTEL XEON CPU CO... |
1 |
3,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
1 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | IR HEAT SPREADER... |
1 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | IR HEAT SPREADER... |
1 |
3,000
In-stock
|
Get Quote |